| Test Name |
EIA 364 TP |
IEC 60512 TP |
MIL-STD-1344 Method No. |
| Mechanical() | |||
| Nominal force() | 04 | none | none |
| Crimp deformation (Crimp) | 07 | 16-7 | 2001 |
| Crimp tensile (Crimp) | 08 | 416 | 2003 |
| Durability () | 09 | 9-1 | 2016 |
| Mating/Unmating (/) | 13 | 13-2 | 2013 |
| Contact retention () | 29 | 15-1 | 2007 |
| Engagement/Separation (/) | 37 | 6-5 | 2014 |
| Vibration() | 28 | 6-4 | 2095 |
| Shock () | 27 | 6-3 | 2004 |
| Electrical() | |||
| Contact resistance() | 06 | 2-2 | 3004 |
| D W V ( ) | 20 | 4-1 | 3001 |
| Insulation resistance () | 21 | 3-1 | 3003 |
| LLCR () | 23 | 2-1 | 3002 |
| Capacitance () | 30 | 22-1 | none |
| Inductance () | 33 | none | none |
| EMI() | 66 | none | 3008 |
| Low-level inductance () | 69 | none | none |
| Current rating() | 70 | 6-1 | none |
| Current cyeling () | 55 | 9-5 | none |
| Environmental() | |||
| Fluid immersion () | 10 | X23 | 1016 |
| Solvent resistance () | 11 | none | none |
| Temperature life () | 17 | 9-2 | 1005 |
| Salt spray () | 26 | 11-6 | 1001 |
| Humidity () | 31 | 11-3 | 1002 |
| Thermal shock () | 32 | 11-4 | 1003 |
| Gas tight () | 36 | none | none |
| Solderability () | 52 | 12-1 | none |
| Porosity(nitric)(()) | 53 | none | 1017 |
| Resistance to solder heat () | 56 | 12-4 | none |
| Porosity(gen)(,) | 60 | none | none |
| Mixed flowing gas (MFG,) | 65 | none | none |
| Combustion () | 81 | none | none |
| Corrosivity () | 82 | none | none |
Comparison Table Of Connector Test Methods Between Different Standards
2020 03/19
